Altus Group, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability. As one of their key suppliers, Heller Industries, a global provider of electronic manufacturing reflow solutions, has developed multi-stage controlled vacuum technology that reduces void rates to below 1%. This technology is especially beneficial for industries like semiconductor and surface-mount technology (SMT) assembly, where maintaining high-quality solder joints is crucial.
With the increasing demand for high-performance electronics, reducing voids in solder joints is essential for ensuring long-term reliability. Heller’s vacuum-assisted reflow soldering process has proven to significantly reduce void rates by up to 99% while addressing substrate and wafer warpage, critical challenges for the electronics manufacturing industry.
Heller’s vacuum technology creates a controlled vacuum environment during the reflow process, allowing gas bubbles to escape, reducing void formation. This results in improved heat dissipation, better product stability, and enhanced performance, particularly in high-
frequency applications. Additionally, the technology helps eliminate solder splatter and prevents solder bridging, further improving manufacturing efficiency.
Heller’s vacuum-assisted reflow technology, now widely implemented across customer installations in production, offers manufacturers a cost-effective solution with high efficiency and low unit per hour (UPH) rates, making it ideal for optimising production without compromising quality.
Through its ongoing collaboration with Heller Industries, Altus is supporting over 200 manufacturing sites in the UK using Heller to improve process reliability, product quality, and operational efficiency, further reinforcing its role as a trusted industry partner.
