Ceramic PCB

Ceramic PCBs are no more an exotic substrate and are now very accessible to PCB designers. Advances in recent production techniques such as Direct Plated Copper (DPC) and Advanced Metal Brazing (AMB) have made ceramics a much more viable choice. With the miniaturisation DPC offers for microelectronics and the need for substrates capable of withstanding high operating temperatures to 800°C whilst offering outstanding thermal conductivity (up to 180W/mK) makes these substrates more popular than ever.

Advantages Over Other Technologies

Heat dissipation is the key advantage that Ceramic has over more conventional materials such as FR4 and Metal Clad PCBs. With components being placed directly on the boards, and no isolation layer, the flow of heat through the boards is far more efficient. Depending on the material chosen, the Thermal Conductivity values range from 24-180W/mK.