Link Hamson Ltd
Inspectis Optical BGA Inspection System ProX
Advanced Optical Side-View BGA Inspection Provides Clear High Quality Imagery of Hidden Solder Joints under BGAs
ProX Advanced Optical Side-View BGA Inspection Provides Clear High Quality Imagery of Hidden Solder Joints under BGAs
Superior Optical Performance
The ProX system includes all the key hardware and the full ProX version of the Inspectis BGA Inspection software.
A fast 5.0MP, USB3.0 digital microscope package powered by INSPECTIS© ProX software for reliable and fast side-view / top-view optical inspection, measurement and documentation.
Can be used with all types of hidden solder joints; BGA, μBGA. FlipChip, CSP, CGA, and also standard SMD component joints and leads
Flexible Inspection
Interchangeable side-view and top-view optics make the Inspectis Basic BGA system the flexible and versatile inspection solution for all post-production processes and R&D optical inspection.
Robust Optical Probe
Precision micro-prisms with special advanced low-aperture optics are carefully assembled in a stainless steel housing to provide a robust BGA Inspection solution offering a longer life.
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