Through Hole Assembly

Our conventional Through Hole Component assembly facility is
staffed with highly experienced assemblers who have access to a
comprehensive range of component forming, placement and
cropping tools and machinery.
Soldering is either by hand or automated wave soldering as
appropriate to the board complexity and batch size.
The wave soldering machine is microprocessor controlled and
operates within precisely controlled parameters using ‘no clean’
minimal residue fluxes to provide reliable high throughput
production.