Silicone Encapsulants for Thermal Management

CHT thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. They also provide protection from harsh environments, vibration and thermal shock. Addition cure silicones provide deep section cure allowing for complete encapsulation for environmental protection whilst maintaining an effective heat path.
With the continued miniaturization and expanding population of components that comprise electronic devices, mitigation of generated heat is an ongoing issue today. To achieve operational stability and longevity, thermally conductive materials are often incorporated within the device to aid in heat dissipation. With the addition of specialty fillers, CHT’s silicone formulations can be customized to facilitate the flow of heat to or from electronic components in an assembly.

General Attributes of CHT Silicone:
• Thermally conductive properties up to 3 W/Mk
• Range includes 1 and 2-part materials
• Includes UL approved products
• High temperature resistance up to 260ºC
• Range of viscosities and hardnesses

CHT SE 3000 – Low viscosity silicone encapsulant with thermal conductivity will speed up production and minimise air entrapment for effect heat transfer. Watch the video.