Tracks Laser & Electronics Ltd
About us
LPKF Electronics Rapid Prototyping systems produce Multilayer PCB circuits in-house directly from CAD data, WITHOUT CHEMICALS utilising LASER or MILLING-DRILLING Techniques. The New ProtoLaser H4 can produce structures of 50 µm on a variety of materials. The equipment range includes through hole plating, Multilayering up to 8 layers, SMT-Assembly, Re-Flow ovens. Everything needed to produce a working prototype PCB in house. SAVE TIME AND MONEY WITH LPKF.
Products & services
LPKF ProtoLaser H4
Enhanced Tabletop Laser System for Fast PCB Processing. Combining the advantages of mechanical drilling of thick substrates including multilayers with extremely fast, contactless, laser surface processing. Plug & play, all-in-one, desktop entry level laser system, the PL H4 comes with built-in computer and software. Only power supply, compressed air and dust extraction need to be connected to process standard single and double-sided FR4 materials, some single-sided RF, PTFE or ceramic filled materials as well as certain flex substrates like Al on PET with 100 μm/30 μm line/space. Flexible materials and foils can be freely positioned and fixed precisely on a vacuum table.
LPKF ProtoMat S104
From design to finished PCB prototype in just a few hours - LPKF systems make it possible. The versatile PCB circuit board plotters fit into any development environment and cover the entire spectrum from analog to RF applications. With comprehensive features for electronics labs: The LPKF ProtoMat S104. Thanks to the high performance spindle and a vacuum table, it is also suitable for RF applications, thin laminates as well as substrates with a sensitive surface (conducting path widths up to 100 μm on FR4 18/18 Cu). In addition, the system processes front panels and housings as well as populated PCBs in 2.5D and provides deep etching in circuit boards.
LPKF PCB MultiLayering
LPKF offers a complete prototyping product line for production of multilayers up to 8 layers in an in-house lab. The multilayers are produced in three simple steps: structuring, lamination, and through-hole plating. Multilayers feature several layers laminated into a single PCB. The outer layers of a multilayer typically consist of PCBs structured on one side only; the material of the inner layers is coated on both sides. Insulating layers, so-called prepregs, are inserted between the layers and the PCB is laminated using the LPKF MultiPress S4. Through-hole connection for up to four layers can be achieved with LPKF ProConduct conductive paste without additional equipment. For multilayers with up to eight layers, the LPKF Contac S4 through-hole plating system is recommended.
Solder Paste Stencil Bureau
Sparks Laser Services is a company specifically formed to meet all your SMT Stencil requirements. Sparks have brought together the best laser cutting machinery from LPKF and highly experienced personnel to offer the best possible service at the most competitive prices. The exceptionally high cutting speed and quality of our lasers enable us to offer a 2 day standard turnaround for both framed and foil type stencils, with 1 day and ½ day services available. All stencils are 100% inspected to the data using the LPKF ScanCheck system. As well as paste and adhesive stencils we are also able to produce a wide variety of stainless steel components.