LPKF PCB MultiLayering

LPKF offers a complete prototyping product line for production of multilayers up to 8 layers in an in-house lab. The multilayers are produced in three simple steps: structuring, lamination, and through-hole plating.

Multilayers feature several layers laminated into a single PCB. The outer layers of a multilayer typically consist of PCBs structured on one side only; the material of the inner layers is coated on both sides. Insulating layers, so-called prepregs, are inserted between the layers and the PCB is laminated using the LPKF MultiPress S4. Through-hole connection for up to four layers can be achieved with LPKF ProConduct conductive paste without additional equipment. For multilayers with up to eight layers, the LPKF Contac S4 through-hole plating system is recommended.