Essemtec SMT Assembly- FOX MFC (Solder Jetting & Pick & Place)

Fox 2 SMT Assembly Solution, capable of Glue Dispensing, Solder Paste Jetting, as well as Pick & Place with 200 lanes, all within 1Mx1M footprint. This unit is designed for flexibility expandable in any direction of functionality.

It is the ideal fit for high mix, low to medium volume and is the ideal unit for NPI, low volume OEM, through to mid volume CEMs. The Fox can drive up to 200 feeders, illustrating its dedication to high-mix production. Due to its small footprint (under 1Mx1M) and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.