Surface Mount Technology

Capabilities
The capability to operate the most efficient systems and processes is assured by our experience and resources across:

- SMT PCB Assembly - prototypes to volume assembly
- BGA and µBGA Assembly - prototypes to volume assembly
- Placement speeds ranging from 3,500 to 27,000 components per hour
- RoHS and Non RoHS processes
- Smallest component 01005’s
- Smallest pitch 30 microns
- Tallest component 15mm
- Largest component / connectors 45 x 100mm
- Placement of all fine-pitch QFP, BGA, µBGA, CSP packages
- PCB size capability from 50 x 50mm to 460 x 440mm
- Two SMT pick and place lines