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Programmable gateway connects Digi XBee enabled devices to remote applications over cellular or Ethernet Digi XBee® Industrial Gateway is a rugged Digi XBee to IP solution. Ideal for any environment, the gateway has an extended temperature range and rugged enclosure. Digi XBee Industrial Gateway features scalable remote configuration and management of Digi XBee networks. By default, all Digi XBee data sent to the gateway is automatically available to online applications via Digi Remote Manager®. With a simple, open-source Python development environment, this gateway also enables custom applications to run locally while interfacing across existing Ethernet or cellular networks for WAN connectivity to cloud-based applications. Digi XBee Gateway products can be managed remotely via Digi Remote Manager, supporting features like remote firmware upgrades, configuration changes and event alarms. With Digi Remote Manager, users can efficiently scale their network from a single device to hundreds of thousands of remote devices. Features – Open-source Python environment for custom application development on the gateway – Out-of-box integration with Digi Remote Manager® enables remote connectivity, configuration and management of Digi XBee networks – ZigBee enabled for connection to local wireless devices – Cellular and Ethernet WAN options for flexible broadband connectivity – Can be deployed in any environment due to industrial temp range and rugged enclosure – Digi Foundations™ 1-, 3- and 5-year subscription available

Digi XBee® modules provide wireless connectivity in a range of protocols and form factors to support today’s low-power applications. Easy-to-deploy, pre-certified, and configurable using Digi XCTU, the Digi XBee Mobile App and Digi Remote Manager® (Digi RM), these low-cost modules support all of your wireless design requirements.

Sumac offers piece part manufacture of machined components and the ability to supply a complete kits. The kit shown here is a sample, three part kit machined and anodised to the customer specification. The kitting capability supported by the business can be anything from 2-3 parts up to >30 parts, delivered direct to customer in bespoke packaging, to suit their customer requirements. Sumac also supports various direct line feed processes, including JIT and Kan-ban and will hold the stock as needed at its site in Weymouth, until the customer pull signal window is opened.

Please email our Kanya Sales Team for information - tonyferreira@kanya-uk.co.uk or chrisdavies@kanya-uk.co.uk

The well-respected Diver end mill from Guhring now has more versions to choose from: * 3-flute and 4-flute solid or coolant through * 4-flute stub length solid carbide * 4-flute with corner radii

Introducing Clearflow 300, a new generation, high-reliability no-clean solder flux designed for the modern electronics industry. This low-solids, halide and rosin/resin-free formula ensures exceptional performance while simplifying your production process. Key Benefits & Features - Minimal Residue Performance: Our advanced "no-clean" formulation leaves minimal, tack-free residues that are non-corrosive and non-reactive with copper and its alloys, meaning post-solder cleaning is not required. - Uncompromising Reliability: Achieve peace of mind with assemblies that conform to stringent industry standards, including IPC-SF-818 and Bellcore TR-NWT-000078. This ensures high surface insulation resistance that resists electromigration and does not degrade over service life. - Superior Solder Joint Quality: Experience rapid wetting and excellent fluxing activity on a wide range of PCB finishes. Clearflow 300 helps rapidly form bright, aesthetically pleasing, and robust solder joints every time. - Versatile Application: Suitable for all types of wave soldering configurations spray and foam, this flux is highly adaptable. It can be used across through-hole, mixed-technology, and surface mount assemblies, and even as a localised rework flux. Application & Availability Clearflow 300 is a clear, colourless liquid with a solids content of 2.14%. Recommended topside preheat temperatures are typically 80°C to 105°C. It is available in convenient 5-litre and 10-litre plastic containers. Physical & Chemical Properties Appearance: Liquid Colour: Clear & Colourless Acid value: (mg KOH/g) 16.5 typ Odour: None Specific Gravity at 25°C: 0.797 Halide content: None Solids content wt/wt: 2.14 Shelf life from supply: One year Flash point: 13°C Health & Safety Note: Treat as a corrosive material and use suitable personal protective equipment.

The DKL 3135 Wire (previously known as Clearflow M1) is a high-performance, lead-free cored solder wire specifically developed for all modern lead-free soldering applications. Engineered to meet the demands of higher temperatures associated with lead-free alloys, this product features a new, high-activation rosin-based flux system that ensures rapid wetting and creates defect-free solder joints. Key Features and Benefits - Superior Performance: Designed for applications requiring increased flux activation with minimal post-soldering residues, which are clear, hard, and can typically be left on the board without cleaning. - High Thermal Stability: The synthetic modified resin provides good thermal stability at high lead-free process temperatures. - Versatile Application: Suitable for both hand and robotic soldering operations. - RoHS & REACH Compliant: This product contains no substances prohibited by European legislation, making it an environmentally responsible choice for modern electronics manufacturing. - Excellent Solderability: Offers exceptional wetting on all lead-free substrates and component finishes, ensuring reliable and strong mechanical bonds. Technical Specifications The DKL Clearflow 3135 Wire is classified per J-STD-004B as ROM1. It is available in various lead-free alloys including SN100C, SN96C (SAC 387), and SN97C (SAC 305). Standard flux content is 2.2%, with options for 1.1%, 3.3%, and 4.6% available. The wire is supplied on 250g, 500g, and 1kg reels in a wide range of diameters from 0.2mm to 3.25mm to suit diverse applications.

DKL Clearflow DK-P6: The High-Reliability, Halogen-Free Solder Paste for Demanding SMT Assembly Elevate your surface mount technology (SMT) operations with DKL Clearflow DK-P6, a premium no-clean, lead-free solder paste engineered for high-reliability electronics manufacturing. Trusted by professionals in demanding environments, the DK-P6 delivers superior performance and robust environmental compliance. Key Features & Benefits: True Halogen and Halide Free (ROL0): Featuring a J-STD-004B ROL0 classified flux chemistry, this paste is verified free of added halogens and halides. It leaves minimal, clear, and safe residues, easily meeting the most stringent environmental and reliability requirements. Consistent, Defect-Free Soldering: Formulated with an 88.5% metal content SAC305 alloy, DK-P6 ensures consistent wetting, reliable joint formation, and defect-free results on various board finishes including OSP, ENIG, silver, tin, and HASL. Superior Print Performance: Available in Type 3, Type 4, and Type 5 powder sizes, the paste offers excellent print definition for fine and ultra-fine pitch components in high-density SMT designs. Extended Production Life: Benefit from an extended open time of over three days and a 72-hour tack life, ensuring long stencil life, reduced downtime, and stable high-volume production. Proven Reliability: Rigorously tested to J-STD-005A and J-STD-004B standards, DK-P6 eliminates solder balling, shows no slump to 0.2mm, and maintains high surface insulation resistance (>100 MΩ), ensuring long-term reliability in harsh conditions. Product Specifications: Alloy: SAC305 (Lead-Free) Metal Content: 88.5% Flux Classification: ROL0 (J-STD-004B) Residues: Clear, Probe-Testable, No-Clean Packaging: 1000g & 500g Cartridges; 1000g, 500g, & 250g Tubs (UK Manufactured) Order DKL Clearflow DK-P6 today for superior quality results and consistent performance across your diverse board technologies.

The Dowsil CC-8000 Conformal Coating Series are one-part, translucent UV and moisture dual-curable coatings offered in low, medium, and high-modulus options. They provided lightning-fast cure without ovens, enabling high throughput and lower energy cost and are specifically designed for automated spray or dispense processing for high volume production. This series of products are ideal for stability in harsh conditions, excellent protection in highly humid environments and protection against contamination. Suitable for the most sensitive electronic components in varied applications and exhibit excellent flame retardancy and electrical properties. The Dowsil CC-8000 Conformal Coating Series includes three variations, differing in viscosities and application methods. This allows manufacturers to select the option best suited to their manufacturing requirements. Dowsil CC-8030 Conformal Coating • Suitable for high-speed production methods such as manual or automated spraying, flow or jetting techniques. This low viscosity material can also be used when coatings need to flow through vias or under chips. Dowsil CC-8033 Conformal Coating • This medium viscosity product can support high-speed production methods, as well as needle dispensing for damming or keep out regions. Dowsil CC-8036 Conformal Coating • Suitable for needle dispensing and applications that require increased control over the speed and distance of flow. This high viscosity material also enables thicker coating layers in one pass. Recommended Applications The Dowsil CC-8000 series are suitable for various applications in the electronics and automotive industries. • Automotive boards & assemblies • Control units • E-motors • Power supplies and modules • Home appliances • Renewable energy applications • Rigid circuit boards

Dowsil one component multi-purpose silicone adhesive sealants are designed to cure at room temperature and to be used for industrial sealing and bonding applications. 1K RTV’s are suitable for applications where you have important temperature differences, CTE mismatches, vibrations to accommodate and maintain a robust adhesion and weather or UV resistance. Some applications include adhering auto, aircraft, and appliance trim. Including metal, fabric, fabric backed plastics, bonding gaskets in heating and refrigeration units and protecting components from moisture due to frequent wash downs or weathering. • DOWSIL 7091 Adhesive Sealant: General sealant with robust adhesion profile • DOWSIL 7092 High Green Strength Adhesive and Sealant: “Green” strength allowing to increase productivity • DOWSIL 7093 Adhesive Sealant: Flowable sealant to cover and/or fill narrow areas • DOWSIL 732 Multi-Purpose Sealant: Clear sealant, FDA approved, good adhesion profile against plastics • DOWSIL Q3-1566 Heat Resistant Adhesive/Sealant: High heat-resistant sealant for very long heat exposure