SOLDERKING ASSEMBLY MATERIALS LIMITED
About us
UK Solder Manufacturer, focused on the development of innovative solder consumables and delivering an exceptional level of technical support services.
Products & services
Hand & Robotic Soldering
SolderKing’s range of flux cored solder wires are suitable for through-hole and surface mount technologies. The range includes No Clean, Water Soluble and Acid Based flux cores produced with a variety of solder alloys and flux grades. SolderKing Cored Solder Wires are extruded using our state of the art production facility and are available in many off the shelf and custom diameters. Our Cored Solder Wires are manufactured to the latest standards and provide users with the highest performance available.
SK P2-5, SAC305, 88.5%, 20-38μm T4 No Clean Solder Paste
Solderking SK P2-5, SAC305, is a no clean lead free solder paste formulated for lead free applications requiring excellent, defect free soldering of even the most difficult to solder components and board finishes. High Reliability solder paste flux type ROL1 to J-STD-004B, SK P2-5 offers excellent print definition for fine pitch printing and reduced voiding and head-in pillow defects. Benefits High reliability solder paste flux type ROL1 to J-STD 004B Reduces and eliminates voiding and head-in pillow defects Powerful wetting on all board finishes Shiny joint finish, Clear minimal residue Long tack and open times 12 months refrigerated shelf life Made in the UK
SK P2-80, SAC305, 88.5%, 20-38μm T4 No Clean Solder Paste
SolderKing SK P2-80 is a no clean, T4 lead free solder paste that offers enhanced printing for miniaturized components. P-80 provides users with increase activation for the most difficult of assemblies. High Reliability solder paste flux type ROL1 to J-STD-004B. SK P2-80 provides powerful wetting on all board finishes, reduced voiding and long tack times. Benefits High reliability solder paste flux type ROL1 to J-STD 004B Reduces and eliminates voiding and head-in pillow defects Powerful wetting on all board finishes Increased activity Shiny joint finish Clear minimal residue Long tack and open times 12 months refrigerated shelf life Made in the UK
SK P2-5, SnBiAg, 89%, 25-45μm T3 Low Melting Point No Clean Solder Paste
Solderking SK P2-5, SnBiAg, is a no clean, low melting point, lead free solder paste. The SnBiAg solder alloy provides users with a reflow peak temperature profile of 170°C-180°C and exhibits a shiny solder joint finish.. High Reliability solder paste flux type ROL1 to J-STD-004B, SK P2-5 SnBiAg offers extended tack and open times in excess of three days. Benefits High reliability solder paste flux type ROL1 to J-STD 004B Reduces and eliminates voiding and head-in pillow defects Powerful wetting on all board finishes Shiny joint finish, Clear minimal residue Long tack and open times 12 months refrigerated shelf life Low Melting Point SnBiAg – 138ºC, Peak Temperature of 170-180ºC. Made in the UK
SK C2-08 Stencil Wipes
C2-08 Stencil Wipes are effective cleaning wipes designed easy and efficient cleaning of stencils. The wipes are saturated in our unique formulation to rapidly remove solder paste, uncured inks and paste flux easily and cleanly. 100 wipes per tub. Benefits Apertured wipes for increased cleaning performance Lint Free Easily removes solder pastes and uncured inks from stencils
SK C1-0
A fast evaporating isopropanol based stencil cleaner suited for manually removing solder paste from stencils and misprinted PCB’s. Benefits Stencil cleaner for effective removal of solder paste, uncured inks and paste flux at room temperature. Fast evaporation rate Environmentally friendly, with low odour and no ozone depleting substances.
SK C3-19
A fast evaporating blend of alcohol and glycol ether based stencil cleaner, offering very efficient removal of both solder paste and un-cured adhesive. Benefits Stencil cleaner for effective removal of solder paste, uncured inks and paste flux at room temperature. Fast evaporation rate Environmentally friendly, with low odour and no ozone depleting substances.
Solder Alloys
SolderKing solder alloys are manufactured using only Virgin Materials to ensure impurity levels are kept to a minimum. As our solder alloys are produced with low impurities this results in faster wetting speeds and increased soldering performance. Using our state of the art production facility, SolderKing solid solder wires are precision manufactured free from surface irregularities and can be applied through automatic feeding systems. SolderKing solid solder wires are used widely for selective solder machines and topping up solder pots. All of our alloys are produced to the latest standard ISO:9453:2020(E) along with J-STD-006, EN 29453, DIN 1707, BS 219, QQS 571E. Available in Lead-free Alloys including: Sc100e SAC405 SAC305 SACXP0307 Also available in Leaded Alloys for professional use including: Sn63Pb37 Sn60Pb40 Sn40Pb60 Available in the following forms: Bar Solder Solid Solder Wire Solder Pellets We have many more solder alloy compositions and a range of diameters available, contact us for more information.
F8 VOC Free Soldering Flux
Solderking SK F8 is a superior water-based, VOC free flux designed for lead free wave and selective soldering operations. SK F8 leaves the absolute minimal of non-greasy and non-tacky post soldering residue. Tested to Industry standards including J-STD 004 flux type ORL0 Benefits VOC Free, No Clean flux Powerful wetting on all board finishes Water-based, non-flammable Exceptional cleanliness Wide process window Sustained activity for dual wave Superior hole fill No solder balling Rosin / resin free, non-tacky RoHS and REACH Compliant Excellent soldering results with all lead free alloys
SK F4-7 Soldering Flux
SK F4-7 is a moderately low solids content alcohol foam and spray no clean flux. With a low level addition of resin, SK F4-7 provides even greater heat stabilisation for lead free soldering operation and is particularly suited to selective soldering operations.SK F4-7 leaves the absolute minimum of non-tacky or surfactant oily residue and is considered an accepted no clean technology when the end use demands the use of a J-STD 004 type ROL0 flux. Benefits Alcohol based Powerful wetting on all board finished Exceptional cleanliness Wide operating and heat activation window No solder balling Superior hole fill RoHS & REACH Compliant Excellent soldering results with all lead free alloys
SK F4-8 Soldering Flux
SK F4-8 Soldering Flux is a high performing, low solids content alcohol foam and spray no clean flux. SK F4-8 has been formulated to provide greater heat stabilisation for lead free soldering operations and is particularly suited to wave and selective soldering operations. SK F4-8 leaves the absolute minimum of non-tacky or surfactant oily residue and is considered an accepted no clean technology when the end use demands the use of a J-STD 004 type ORL0 flux.
CXW-70 No Clean Cored Solder Wires
A high performing clear residue, no clean cored solder wire for consistent, fast flowing robot soldering for consumer electronics soldering operations. Excellent wetting of all lead-free substrates and component finishes. Flux type ROL1 to J-STD 004. Benefits Very fast soldering Suitable for fast high speed robot soldering Powerful wetting Clear, minimal, and non-tacky residue Low odour, non-offensive fume Diameters from 3.25 mm to 0.27 mm
KingsFlux Acid Cored Solder Wires
KingsFlux Acid Cored Solder Wire is a highly active solder wire suitable for effective soldering of heavily oxidised finishes. Rapid soldering can be achieved on most common metals excluding Aluminium. This product is not suitable for electronic applications and residues must be removed with warm water. Benefits Highest activity available Residues easily removed Low odour, non-offensive fume Easy to use Excellent thermal stability
WS-OA Water Soluble Cored Solder Wires
WS-OA is a colophony free, water soluble solder wire for hand assembly applications that require residues to be removed with water. WS-OA is a superior wetting water soluble cored solder wire that has no offensive odour or spatter when soldering. Developed with a halide activated formulation the WS-OA provides users with rapid oxide removal and powerful wetting on all plating and surface finishes. Flux type ORH1 to J-STD 004. Benefits Very fast soldering Halide activated flux Powerful wetting Residues removed easily with water Low odour, non-offensive fume Easy to use
Halogen Free Flux Gel
A halogen free, clear tacky flux gel, this flux gel provides good activity for re-working / repairing components soldered with lead and lead free alloys. Halogen Free Flux Gel is also suited to tinning operations which require a viscous gel. Suitable for all commercial electronic manufacturing soldering operations where the use of a IPC flux type ROL0 is considered an accepted no clean technology. Benefits Halogen Free, No Clean J-STD 004 Flux type ROL0 Powerful wetting on all board finishes Easily removable residues RoHS and REACH Compliant Suitable with all leaded and leadfree alloys
G9 Flux Gel
A halogen free, clear residue, tacky flux which provides excellent soldering performance for lead free repair and re-work operations. SK G9 Gel is suitable or all electronic manufacturing soldering operations where the use of a J-STD004B flux type ROL0 is considered an accepted no clean technology. Benefits Halogen Free, No Clean J-STD 004 Flux type ROL0 Powerful wetting on all board finishes Easily removable residues RoHS and REACH Compliant Improved performance for lead free alloys.
F3-15 Low Solids Rework Flux
A very low solids content, halogen and resin free, alcohol based no clean flux. Offered as a re-work flux provided in nib-push re-work pens and supplied as bulk in bottles. SK F3-15 leaves a minimum non tacky or greasy residue and is recommended for no clean soldering when a J-STD 004 flux type ORL0 is considered acceptable for the assembly end use specification. Benefits Halogen Free, No Clean RoHS & REACH Compliant Re-work and assembly use Very low solids, very clean results Suitable for Lead Free applications
KingsFlux FT-08w Soldering Flux
A low solids (~4%), rosin / resin and VOC free flux for copper cable tinning when resin residues are not acceptable. The activator in FT-08w is neutralised with soldering temperature and leaves virtually zero non-corrosive residues after soldering. Benefits Water Based Powerful Wetting Reduced Heating Time Non Corrosive Residues Efficient on Plain Copper and Brass Very Clean Residues
J-80 SAC305, 15-25μm T5 Solder Paste
The SolderKing J-80 SAC305, 15-25μm T5 is a no clean, lead free jet dispensing solder paste formulated for excellent performance. The J-80 provides users with uniform dots as small as 220μm and exhibits exceptional results when operating at high speed. High Reliability solder paste flux type ROL1 to J-STD-004B and defect free soldering of even the most difficult to solder components and board finishes. Benefits High reliability solder paste flux type ROL1 to J-STD 004B Uniform Dots of 220μm Powerful wetting on all board finishes Reduces or eliminates voiding Shiny joint finish, Clear minimal residue Long tack times 6 months refrigerated shelf life Made in the UK
Temporary Solder Mask
Solderking Temporary Solder Mask is a fast curing latex type solder masking agent. The Solder Mask is supplied in a 250cc squeeze bottle and easily applied to pins and contacts to protect during the wave soldering process. Suitable for both RoHS Compliant and Leaded Soldering. Benefits: Fast Drying Suitable for Leaded and Lead Free Soldering Leaves no residue 250cc Squeeze Bottle Easily applied RoHS & REACH Compliant