SK F4-7 Soldering Flux

SK F4-7 is a moderately low solids content alcohol foam and spray no clean flux. With a low level addition of resin, SK F4-7 provides even greater heat stabilisation for lead free soldering operation and is particularly suited to selective soldering operations.SK F4-7 leaves the absolute minimum of non-tacky or surfactant oily residue and is considered an accepted no clean technology when the end use demands the use of a J-STD 004 type ROL0 flux.

Benefits
Alcohol based
Powerful wetting on all board finished
Exceptional cleanliness
Wide operating and heat activation window
No solder balling
Superior hole fill
RoHS & REACH Compliant
Excellent soldering results with all lead free alloys