1951 results found
    1. MY700 Jet Printer

      MY700 Jet Printer

      Mycronic jet printing technology makes it possible to dispense solder paste for the most challenging circuit boards and components, with micrometer accuracy, maximum speed and perfect quality solder joints. The jet printer is equipped with high-precision, high-throughput jetting heads that use state-of-the-art motion system with 3G acceleration. At speeds of more than one million dots per hour, the two ejectors can be used to cover the widest possible range of solder paste dot volumes for very small and large components. Thanks to a new dual-lane conveyor system and optional extended buffer zone, the next board is always ready and in jetting position, thus reducing board transfer time to a bare minimum. Key features: - 100% software-driven and operator-independent - State-of-the-art motion system with 3G acceleration which - Versatile dual-head, dual-lane design - Automatic board stretch compensation - Complete volume control and dot consistency - New 30% narrower design for a smaller footprint

    2. MYPro 3D AOI

      MYPro 3D AOI

      The new MYPro I series 3D AOI offers one of the most powerful AOI systems on the market now powered by AI-assisted software (GenI and Escape Tracker) and featuring a next generation 3D vision technology for faster and sharper processing. Thanks to a new generation of laser-based 3D sensor, optics and computing systems, Iris enables the industry’s highest quality 2D and 3D image capture at speeds up to 30% faster than K3D technology. All so you can capture every detail in unprecedented resolution even at the most demanding takt times. MYPro I series features a next-generation self-checking inspection performance system. With Escape Tracker, the user is immediately informed of any errors or programming weaknesses that could potentially generate false calls or escapes. DeepReview is a new a new AI-based Automatic Defect Classification system that trains itself to analyze new components, automatically classify defects and eliminate the vast majority of false calls. Key Features: - Outstanding image acquisition - Powered by AI systems - Superior accuracy - Complete test coverage

    3. MYPro A40 Pick and Place

      MYPro A40 Pick and Place

      MYPro A40™ delivers the high accuracy and fast changeovers together with a dramatic increase in throughput speed. All MYPro A40DX models include two MX7 high-speed mountheads and one MIDAS high-precision mounthead. Handle the widest possible range of components and batch sizes with the highest productivity and fastest cycle times. Key benefits: - Up to 224 x 8 mm reels - Top speed of 59,000 CPH - Larger range of components - On-the-fly changeovers - Electrical verification of resistors, capacitors, diodes and transistors (optional) - Full traceability

    4. MYPro S30 - Stencil Printer

      MYPro S30 - Stencil Printer

      MYPro S series is bringing leading-edge accuracy and repeatability to stencil printing, making it easier and more cost-efcient than ever to scale up your production throughput. It’s all part of one integrated approach to solder paste printing. And one scalable solution for tomorrow’s printing demands. Key Features: - Intelligent vision and 2D inspection - Reliable squeegee system - Quick stencil positioning stopper - Motorized table height adjustment - Closed-loop squeegee pressure control - Z-axis control - Dry/wet/vacuum cleaning module By introducing our stencil printers and combining them with jet printing and 3D SPI technologies zero-defect printing has now become a possibility. You can correct any missing or insufficient deposit before it enters the placement process and eliminate any print defects to achieve 100% yield.

    5. MYTower Component Storage

      MYTower Component Storage

      The MYTower is an automated, highly flexible and expandable buffer storage unit for electronic components, designed for deployment near the production line. It provides intelligent and automatic access to component reels and trays and help reduce retrieval time and manual labour. Key Features: - Fast storage & retreival of components - Minimised floorspace and maximised capacity - Easy integration with any system - Controlled environment and floor life monitoring for MSD components - Alarms for material availability - Traceability functions - Quantity control

    6. N Type Sealed IP68 Front Mount Bulkhead Crimp  Top Hat Clamp Jack (25-291-P3-AW)

      N Type Sealed IP68 Front Mount Bulkhead Crimp Top Hat Clamp Jack (25-291-P3-AW)

      N Type 50 ohm front mount bulkhead jack IP68 sealed to 10 meters x 4 Hours Un-Mated. The crimp bullet contact and centre contact are Silver plated and the outer body is white bronze for use in harsh environment. The connector is internally sealed and using a top hat clamp system makes this connector IP68 rated. Fits a mounting hole with two flats from the front of the panel. Suitable for cables in COAX cables group AW.

    7. N Type Stainless Steel Bulkhead Rear Mount Solder  Solder Jack ( 2 Flats ) (25-217-H3-HB)

      N Type Stainless Steel Bulkhead Rear Mount Solder Solder Jack ( 2 Flats ) (25-217-H3-HB)

      N Type 50 ohm rear mount bulkhead jack for direct solder to semi-rigid cable. The contact is gold plated as is the rear body for soldering to the copper jacket of the cable. The outer contact body, Hex nut and Locking Washer are made from passivated stainless steel the Solder Body is gold plated stainless steel . Fits a mounting hole with 2 flats. Suitable RG402 (0.141″) semi rigid and similar cables in COAX cable group HB.

    8. NCAB Environmental Roadmap

      NCAB Environmental Roadmap

      We are facing massive challenges to protect our climate and our nature. On the one hand, PCBs are one of the key components of the green energy transition the world is currently undergoing. But on the other hand, the production of printed circuit boards has an impact on the environment with a lot of complex challenges to solve. At NCAB Group, we strive to be a catalyst for a more sustainable PCB and manufacturing. Our goal is to ensure that our PCBs are produced in a way that minimizes the total environmental impact. Our overall climate impact goal is: – Reduce our Greenhouse Gas emission intensity with 50% by 2030 (Scope 1-3). Baseline year 2021 (28.7 tCO2/MSEK).