SN100C Electronic Lead-Free Solder

Introducing SN100C: The Gold Standard in Silver-Free, Lead-Free Solder

Elevate your manufacturing with SN100C, an innovative tin–copper alloy delivering unmatched performance, reliability, and cost efficiency in lead-free soldering. Developed by Nihon Superior and proven since 1999, SN100C excels in wave and selective soldering, offering a superior and cost-effective alternative to traditional tin–silver–copper (SAC) alloys.

The SN100C Advantage: Performance Meets Economy

This alloy is a precisely melted eutectic mix of tin, copper, nickel, and germanium (Sn/Cu0.7/Ni0.05+Ge) melting at 227°C for consistent, reliable results.

• Cost-effective: Eliminates silver, a costly SAC alloy element, reducing material costs.
• Superior wetting and joint quality thanks to nickel and germanium, producing bright, smooth solder joints free of micro-cracks and bridging.
• Reduced copper erosion: Nickel creates a protective barrier, extending solder bath life and safeguarding PCB pads and through-holes.
• Low dross formation: Germanium acts as a strong antioxidant, minimising dross to levels comparable or better than traditional tin–lead solder.
• Enhanced reliability: Stable intermetallic layers and improved thermal fatigue and creep resistance support durable performance in harsh environments.
• Process efficiency: Suitable for existing wave soldering parameters without nitrogen atmosphere needs, easing the shift to lead-free.

Proven reliability is backed by strict quality control and RoHS compliance, with millions of PCBs made using SN100C across consumer and industrial sectors.

Available in bars, ingots, tinmans, chunks, blowpipe, wire, and paste to suit various soldering processes including wave, selective, hand, and high-speed automated assembly.

Experience industry-leading performance and cost savings with the original silver-free, lead-free solder alloy. Contact us to optimise your manufacturing with SN100C.