DKL Clearflow 300 Flux

Introducing Clearflow 300, a new generation, high-reliability no-clean solder flux designed for the modern electronics industry. This low-solids, halide and rosin/resin-free formula ensures exceptional performance while simplifying your production process.

Key Benefits & Features

- Minimal Residue Performance: Our advanced "no-clean" formulation leaves minimal, tack-free residues that are non-corrosive and non-reactive with copper and its alloys, meaning post-solder cleaning is not required.

- Uncompromising Reliability: Achieve peace of mind with assemblies that conform to stringent industry standards, including IPC-SF-818 and Bellcore TR-NWT-000078. This ensures high surface insulation resistance that resists electromigration and does not degrade over service life.

- Superior Solder Joint Quality: Experience rapid wetting and excellent fluxing activity on a wide range of PCB finishes. Clearflow 300 helps rapidly form bright, aesthetically pleasing, and robust solder joints every time.

- Versatile Application: Suitable for all types of wave soldering configurations spray and foam, this flux is highly adaptable. It can be used across through-hole, mixed-technology, and surface mount assemblies, and even as a localised rework flux.

Application & Availability

Clearflow 300 is a clear, colourless liquid with a solids content of 2.14%. Recommended topside preheat temperatures are typically 80°C to 105°C. It is available in convenient 5-litre and 10-litre plastic containers.

Physical & Chemical Properties

Appearance: Liquid Colour: Clear & Colourless
Acid value: (mg KOH/g) 16.5 typ Odour: None
Specific Gravity at 25°C: 0.797 Halide content: None
Solids content wt/wt: 2.14 Shelf life from supply: One year
Flash point: 13°C

Health & Safety Note: Treat as a corrosive material and use suitable personal protective equipment.