1810 results found
    1. Solder Paste Stencil Bureau

      Solder Paste Stencil Bureau

      Sparks Laser Services is a company specifically formed to meet all your SMT Stencil requirements. Sparks have brought together the best laser cutting machinery from LPKF and highly experienced personnel to offer the best possible service at the most competitive prices. The exceptionally high cutting speed and quality of our lasers enable us to offer a 2 day standard turnaround for both framed and foil type stencils, with 1 day and ½ day services available. All stencils are 100% inspected to the data using the LPKF ScanCheck system. As well as paste and adhesive stencils we are also able to produce a wide variety of stainless steel components.

    2. Solder paste stencil laser cutting

      Solder paste stencil laser cutting

      We take your data and manufacture laser-cut stainless solder paste stencils in steel shim style. Put our service to the test with our introductory offer of one sample solder paste stencil without charge, cut to your data. Our laser cut solder paste stencil service is suitable for anyone assembling surface-mounted components and needs to screenprint solder paste onto PCBs. This low-cost service offers a fast turnaround and allows you to avoid additional repeated royalty and licence fees by using a non-proprietary Zelflex frame tension system. We’ll edit your stencil data to incorporate tooling holes, frame mounting holes, frame mounting holes, tool numbers, text, fiducials, steps and repeats and more. Each of your solder stencils is then supplied in storage wallets which are secured by Velcro with hooks for hanging storage. We manufacture foil type stencils using either 0.125 or 0.150mm thick stainless steel sheets that are specifically rolled for solder paste screens. Frame mounting holes are cut to suit each client’s individual mounting system requirements. If you are looking for a low-cost foil stencil for a small production run when frame mount holes may not be required, consider our competitively priced one-day delivery express stencil service.

    3. Solder Wire - DB-1 RMA

      Solder Wire - DB-1 RMA

      You can achieve more with a balanced combination of speed and endurance - this principle is the basis of our dual boost products. Almit's solder wire innovation DB-1 RMA has opened up a new dimension in wetting. With the combined power of a fast and a persistent activator, it achieves both good initial wetting and convincing through-hole wetting. Additionally, Almit found that most L0 and L1 solder pastes available on the market showed inferior results in term of coalescence and wetting ability on various substrates. This has provided the impetus for the development of another innovation in the Dual Boost family: The halogen-free solder paste NH-GE. It shows significantly imporved coalescence on small equipment compared to the halogen-activated standard paste. NH-GE offers a new halogen-free standard that has not even been achieved by halogen-activated solder pastes and leaves the usual difficulties caused by conventional solder pastes behind. Free yourself from the external influence of poor quality solder pastes and increase your production level!

    4. Solvent Cleaning machines

      Solvent Cleaning machines

      Introducing the KP Modified Alcohol Solvent Cleaning Machines, an advanced solution for sustainable material waste recovery. These machines, compatible with modified alcohols, provide several benefits to optimise operations. With minimal solvent loss, they offer cost savings and reduce environmental impact. By utilising distillation, separation, and filtration methods, contaminants are efficiently eliminated, enabling oil reuse and economical disposal or reuse of swarf and particles. Introducing the advanced KP Modified Alcohol Washing Machines, featuring state-of-the-art technology for exceptional cleaning performance with environmental safety in mind. These cutting-edge systems utilise a comprehensive vacuum treatment cycle to thoroughly clean finished products while preventing the release of hazardous substances. By combining spray, basket rotation, aqueous cleaning, modified alcohol hydrocarbons, hydrocarbons HFE, and ultrasonic technologies, these machines effectively remove stubborn contaminants, leaving your products pristine and ready for use. Versatility is a key feature of these machines, as they can work with a wide range of materials, including AVP, AVZ, PR 80, 16CrNi4, 16Cr-Ni4Pb, 18CrMo5, 42CrMS4, Aluminium 11s, Brass, Stainless Steel Aisi 303, ETG 88, ETG 100, PVC, Teflon, Ergal, and various copper, bronze, and cast-iron alloys. The KP Modified Alcohol Washing Machines find ideal applications in precision mechanics, automotive, heat treatment, oleodynamic components, springs, moulded components, fashion accessories, jewellery, watches, furniture components, medical and dental equipment, cookware, cutlery, and electronics. Experience the power of Kleen Power Technology and enjoy the benefits of enhanced efficiency, reduced waste, and sustainable practises in your operations. Call Kemet on +44(0) 1622 755287 or email Sales@Kemet.co.uk to arrange cleaning trials, so Kemet can ascertain the perfect cleaning approach for you.

    5. SoM Module with Efinix Titanium FPGA

      SoM Module with Efinix Titanium FPGA

      The SoM6 Ti135 is a compact, low-power System-on-Module (SoM) built around the Efinix Titanium Ti135 FPGA, specifically utilizing the high-density N676 FBGA package. Designed for advanced embedded applications that require performance, flexibility, and energy efficiency, the SoM6 Ti135 integrates a rich set of modern features in a form factor that emphasises modularity and interoperability. At the core of the SoM is the Efinix Ti135 FPGA, fabricated on a TSMC 16nm process and featuring the Quantum™ compute fabric. This fabric includes: • Up to 129,600 logic elements using eXchangeable Logic and Routing (XLR) cells • 960 blocks of 10-kbit SRAM (totaling ~9.83 Mbits) • 480 DSP blocks supporting integer and BFLOAT16 computations • A quad-core hardened RISC-V processor with full support for RV32IMACFD extensions This makes the SoM6 Ti135 a strong candidate for edge computing, real-time control, and vision-centric workloads. The SoM integrates several high-speed interfaces: • Two full-duplex transceiver banks (not fully routed on the SoM) capable of, 10G Ethernet (10GBase-KR), SGMII, and PMA Direct operation with data rates from 1.25 Gbps to 12.5 Gbps per lane. PCIe Gen 4 is supported at x1 only. • Dedicated SERDES routing for PCIe and 10G Ethernet • Extended MIPI D-PHY capabilities supporting up to 2.5 Gbps per lane (TX and RX) via two 30-pin FPC connectors • A RAW-PMA interface for implementing proprietary high-speed protocols over transceivers All additional I/O, including power, configuration, and general-purpose signals, are routed through a 240-pin connector . This connector is primarily pin-compatible with the AMD Kria K24 SoM, offering a migration path or interoperability for carriers; however, full application-level compatibility cannot be guaranteed due to architectural differences between Efinix’s and AMD’s FPGAs For onboard non-volatile memory, the SoM6 Ti135 includes: • eMMC flash storage (soldered on-module for robustness and space efficiency)